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AS5215
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 6 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
Electrical Parameters
Supply voltage (V DD )
Input pin voltage (V_in)
-0.3
-0.3
7
V DD +0.3
V
V
Input current (latchup immunity), I_scr
-100
100
mA
Norm: EIA/JESD78 Class II Level A
Electrostatic Discharge
Electrostatic discharge (ESD)
±2
kV
Norm: JESD22-A114E
Continous Power Dissipation
Total power dissipation (P tot )
275
mW
Package thermal resistance ( Θ _JA)
27
oC/W
Velocity =0; Multi Layer PCB; Jedec Standard Testboard
Temperature Ranges and Storage Conditions
Storage temperature (T_strg)
-65
150
oC
Package body temperature (T_body)
260
oC
Norm: IPC/JEDEC J-STD-020.
The reflow peak soldering temperature (body temperature)
specified is in accordance with IPC/JEDEC J-STD-020
“Moisture/Reflow Sensitivity Classification for Non-
Hermetic Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
Humidity non-condensing
5
85
%
Moisture Sensitive Level (MSL)
www.austriamicrosystems.com/AS5215
3
Revision 1.11
Represents a maximum floor time of 168h
5 - 26
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